Levasil Colloidal Silica can be used like "hi-tech” abrasive, for shaping, smoothing, and polishing silicon wafers, glass, sapphire, and other precision substrate materials. Colloidal silica is a critical component for producing ultra-flat, low-defect and uniform surfaces in for example semiconductor manufacturing.

It performs well as a rough surface remover and final polishing additive, and eliminates the need for other surface preparation steps.

In chemical-mechanical planarization (CMP), colloidal silica is used to flatten out the irregularities in the films applied to the semiconductor substrates during integrated circuit fabrication.

With colloidal silica in the slurry, different substrates such as silicon, glass, aluminum and sapphire can be polished to a surface roughness of nanometer, or if needed to Angstrom level.
We constantly have new products in the pipeline – and work close with industry partners to develop tailor-made solutions for specific surface polishing applications.


A selection of our Levasil SP products for surface polishing:

 

Product

Particle Size (nm)

pH

Solids Content

Particle size distribution/
morphology

Levasil SP1039

100

9.5

50%

Narrow
Spherical

Levasil SP1197 LM

25

9.0

30%

Narrow
Spherical

Levasil SP2138

31

9.5

41.5%

Narrow
Spherical

Levasil SP3048

145

9.8

40%

Wide
Spherical

Levasil SP5069

105

9.0

50%

Wide
Irregular
(potato shaped)

Wide selection of products


In addition to the Levasil SP products that are specifically designed to match electronic industry needs, we manufacture and sell a wide selection of Levasil Colloidal Silica products with different physical and chemical properties.

Concentrations: 7– 50% SiO2
Particle size distributions: narrow, medium or wide Structures: Discrete particles or chains
Particle diameters: 2–150 nm
Surface areas: 30-1100 m2/g
pH: 2–12
Modifications: ammonium, aluminate, chloride, silane, deionized
Morphology: Spherical or irregular